3D-Xray Hybrid Inspection System YSi-X Feature
Complete renewal and updating of both hardware and image processing software has vastly improved x-ray 3D imaging and led to the advanced TypeHD/TypeHB.
Inspection with 3D X-rays Slice Section Image
Fault layer inspection by X-ray CT
This inspection checks the BGA soldering and so extracts 3D images of just the solder connection.
Hybrid inspections for high reliability
Equipped with 3D X-ray, 2D X-ray, Visible, Laser and Infrared
Three-color of the 3 layers → Optical inspection
Floating leads and component bodies → Laser inspection
Solder joint → 3D X-ray Inspection
Void inspection performance boosted by 3D X-Ray CT image processing Enhanced void inspections mitigate effects from multilayer/back-side component, component build-in board, etc.
PCB warping is corrected with XYZ fiducial function
High accuracy information is essential for extracting image of joint surface.
Data Link with Mounter
Easily load YAMAHA mounter data and import it to inspection data
Mounter data
- Mounting data
- BGA pin information
- Fiducial data
- Component lead shape
Makes inspection data
- Assigns inspection field of view
- Auto collating of inspection library data
ECO
ECO operation capable of 3D imaging by pulse emission with minimal X-ray irradiation
X-ray source & X-ray detector material renewal fee service contracts are also available.
(Contact us for inquiries regarding conditions and price, etc.)
Related contents
- Product
- Introduce our product lineup, including surface mounters, solder printers, and visual inspection machines.
- Showroom
- Find and explore SMT Smart Showroom or Virtual Showroom
- Intelligent Factory
- IoT/M2M Integration system - System allows linking our SMT machines to equipment made by other companies and give all-around high productivity in the mounting process.
