- “1-head solution” to perform various inspections with a single head
- Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
- A thorough and extensive machine-to-machine (M2M) solution
- Statistical Process Control (SPC) for diverse statistical processing
- Optional features to enable handling various products
|Applicable PCB||L510×W460mm～L50×W50mm (single lane spec)
*No dual lane specification available.
|Horizontal resolution (FOV size)||1）25µm / 12.5µm (approx. 50×50mm)
2）20µm / 10µm (approx. 40×40mm)
3）15µm / 7.5µm (approx. 30×30mm)
*All are standard selection type.
|Inspection items||Solder paste printing quality (volume, height, area and misalignment)|
|Power supply||Single-phase AC 200V–230V ±10%|
|Air supply source||Airless specification|
|External dimension||L904×W1,080×H1,478 mm|
|Weight||Approx. 550 kg|
- Specifications and appearance are subject to change without prior notice.