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Yamaha Motor Revs Your Heart

SMT ASSEMBLY SYSTEM

YSi-SP

3D Solder Paste Inspection Machine

YSi-SP
YSi-SP
  • “1-head solution” to perform various inspections with a single head
  • Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more
  • A thorough and extensive machine-to-machine (M2M) solution
  • Statistical Process Control (SPC) for diverse statistical processing
  • Optional features to enable handling various products

Specifications

YSi-SP
Applicable PCB L510×W460mm~L50×W50mm (single lane spec)
*No dual lane specification available.
Horizontal resolution (FOV size) 1)25µm / 12.5µm (approx. 50×50mm)
2)20µm / 10µm (approx. 40×40mm)
3)15µm / 7.5µm (approx. 30×30mm)
*All are standard selection type.
Height resolution 1µm
Inspection items Solder paste printing quality (volume, height, area and misalignment)
Power supply Single-phase AC 200V–230V ±10%
Air supply source Airless specification
External dimension L904×W1,080×H1,478 mm
Weight Approx. 550 kg
Specifications and appearance are subject to change without prior notice.
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