- High bonding accuracy and x3 productivity of conventional machines!
This brings a New Era in Semiconductor packaging for the expanding flip chip market.
- High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
- High-Accuracy ±5μm (3σ)
- High-Quality & Flexibility
|Applicable substrate||L240 x W200 to L50 x W50mm|
|Substrate thickness||0.2 to 3.0mm|
|Transport direction||Left to Right (option : Right to Left)|
|Bonding accuracy||±5µm (3σ) (When using Yamaha's standard components)|
|Throughput||13,000UPH (Including processing time)|
|Applicable wafer size||12 inch wafer|
|Applicable die size||□2 to 30mm|
|Power supply||3-Phase AC 200/208/220/240/380/400/416V ±10% 50/60Hz|
|Air supply||0.45MPa or more|
|External dimension||L2,090 x D1,866 x H1,550mm (YSB55w main unit & wafer feed unit)|
|Weight||Approx. 3,600kg (YSB55w main unit & wafer feed unit)|
- Specifications and appearance are subject to change without prior notice.