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Yamaha Motor Revs Your Heart

SMT ASSEMBLY SYSTEM

High-Speed & High-Accuracy Flip Chip Bonder YSB55w Overview

High bonding accuracy and x3 productivity of conventional machines! This brings a New Era in Semiconductor packaging for the expanding flip chip market.

High-Speed & High-Accuracy Flip Chip Bonder YSB55w
High-Speed & High-Accuracy Flip Chip Bonder YSB55w
  • High bonding accuracy and x3 productivity of conventional machines!
    This brings a New Era in Semiconductor packaging for the expanding flip chip market.
  • High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
  • High-Accuracy ±5μm (3σ)
  • High-Quality & Flexibility

Function and Feature

High-Speed. 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH

Multi-die supply

Wafer feed unit

High rigidity frame & beam

Promotion Movie

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