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SMT ASSEMBLY SYSTEM

Flip Chip Bonder & Hybrid Placer

Hybrid Placer Intelligent Cubic

Japanese

Chinese

Lineup

i-Cube10

i-Cube10

Mounting capability : 10,800CPH
Mounting accuracy (3σ) : ±15μm
Wafer supply : 8 inch or smaller

YSB55w

YSB55w

Mounting capability : 13,000UPH
Mounting accuracy (3σ) : ±5μm
Wafer supply : 12 inch or smaller

* YSB55w is a product of SHINKAWA LTD..

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