Flip Chip Bonder & Hybrid Placer Hybrid Placer Intelligent Cubic Japanese Chinese Lineup i-Cube10 Mounting capability : 10,800CPH Mounting accuracy (3σ) : ±15μm Wafer supply : 8 inch or smaller YSB55w Mounting capability : 13,000UPH Mounting accuracy (3σ) : ±5μm Wafer supply : 12 inch or smaller * YSB55w is a product of SHINKAWA LTD.. Related contents Product Introduce our product lineup, including surface mounters, solder printers, and visual inspection machines. Showroom Find and explore SMT Smart Showroom or Virtual Showroom Sales Network Catalogue Request Concept History of Yamaha SMT Business The Quality of 100% Made ㏌ Japan Recipes for Fully Automated Lines Product Surface Mounter Solder-Paste Printer Dispenser Inspection System Flip Chip Bonder & Hybrid Placer SMD Storage System Management Software Intelligent Factory YSUP SEMI SMT-ELS Sales Network JAPAN Offices ASIA OCEANIA EUROPE AMERICA AFRICA Support & Service Remote Machine Support Yamaha Support and Service WEB 24h Support Service Extended Warranty Case Studies Model Lineup Showroom Showroom Virtual Showroom News News Exhibition Exhibition
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