“1-head solution” to perform various
inspections with a single head
One head type supports all types of inspections. Eliminate all types of losses such as time and cost to increase your actual productivity.
Achieves high-accuracy high-speed inspections using
3D+2D inspection, image resolution switch-over and more
Highly accurate 3D inspections by applying unique 3-step algorithm
02Surface area measurement
High precision 2D contour extraction
Reproduces accurate shapes by combining with phase shift method.
Select from a maximum 3 types of resolution
Super high-resolution technology makes automated inspections on the same type PCB while switching between a maximum of 3 resolution levels Unit flexibly handles components from super-tiny components to large-size components.
Extensive machine-to-machine (M2M)solution
The Yamaha brand can provide all main equipment needed for component mounting in one package and by linking SPI with each piece of equipment creates a production line having boosted quality and productivity.
Automatic setup changes
Settings such as production line PCB data and conveyor width are sequentially sent from upstream units by scanning ID such as for barcodes listed on PCB and instruction sheets to automatically to shorten the time needed to switch setups and make changeovers.
Feedback print offset
Feedback print offset and initiate cleaning cycle acquired by SPI to the downstream printer to give high print quality.
Remote pass-fail judgment
One PC handles second pass-fail judgment of both AOI and SPI.
This makes better job efficiency of second pass-fail judgment.
Automatically converts coating inspection data
Create coating data from the dispenser and send to SPI in just one click!
Simultaneous image display in each process (Process Correlation)
Swiftly pinpoints the process where a failure occurred by displaying images from and the production status of each process simultaneously to support production process quality improvement.
Solder paste printing analysis
Displays link between fluctuations in solder size and solder paste printing status and allows checking the solder paste printer status when defects or problems occur. Streamline quality improvements and line operating rate.