Glossary
| Terms | Explanations |
|---|---|
| ASIC | It is stand for Application Specific Integrated Circuit. |
| DIP | A type of semiconductor packaging method. A rectangular package with external input and output pins facing downward on each long side. Wave soldering (Flow soldering) is sometimes referred to as DIP or DIP soldering. |
| MSD | Semiconductors and other electronic components that need to be managed by MSL(Moisture Sensitive Level). |
| MSL | It is stand for Moisture Sensitive Level. A standard for JEDEC that is established to prevent packaged resins, such as semiconductors, from being damaged from volume expansion due to vaporization during reflow heating by absorbing moisture in general environments. |
| SMD | It is stand for Surface Mount Device. Unlike the conventional method of drilling holes in a board and soldering leads therethrough, this is a part manufactured so that it can be mounted only by soldering on the PCB surface. |
| Axial parts | An electronic component in which leads are drawn straight from both ends of a part, and both ends of the lead are supplied in a form fixed to tape. After cutting and bending the lead to the appropriate length, insert it into the hole on the board for soldering. Automatic machine-mounting is possible, and soldering by wave soldering machine is common. |
| Wafer | Semiconductor base (substrates) material. Ultra-flat and ultra-clean discs made from high-purity polycrystalline silicon, with surfaces polished to mirror surfaces to eliminate fine irregularities and fine particles to the limit. The circuit is formed by exposure and packaged after dicing. |
| Silver paste | A conductive bonding material that replaces solder. Low-temperature bonding is possible, it is used for bonding or the like of a material having low heat resistance. As it is expensive, it is often supplied by dispensing. |
| Baking | The act of making electronic components and boards that deviate from the MSL(Moisture Sensitve Level) reusable by heating them in a thermostatic oven or the like to evaporate moisture. |
| Radial component | An electronic component in which multiple leads come out from one direction of a component, and the leads are supplied in a form fixed to tape. After cutting the lead to the appropriate length, insert it into the hole on the board for soldering. Automatic machine-mounting is possible, and soldering by wave soldering machine is common. |
| Lead frame | Components used in semiconductor packages such as semiconductors and integrated circuits to support and fix semiconductor elements and connect them to external wiring. |
| Waffle tray | Items that store semiconductors, electronic components, etc. It is called this way because the pocket is shaped like a sweet waffle. Typical sizes are 2 inches, 4 inches, etc. |
