|3S head||Yamaha original squeegee head with variable attack angle by servo motor developed ahead of the industry. Attack angle can be varied in 1° increments. There are various merits such as reduction of solder consumption by reduction of required solder input and shortening of cleaning work.|
|12oz syringe||This solder container has a capacity of 2 to 2.8 times as large as the 500 g pot ratio, and can reduce the frequency of container replacement in the automatic supply of cream solder, realizing unmanned stop operation for a long time. |
It is supported by the optional function PSC of YSP10.
|Off-contact printing||A technique used for printing with mesh screens.|
A fixed gap is provided between the screen and the workpiece(usually PCB), and only when the squeegee passes, close contact is made, and filling and plate separation are performed almost simultaneously.
Effective when printing ink with low viscosity, etc.
In SMT process, contact printing in which a metal mask and a board adhere to each other is common.
|Attack angle||The angle of the squeegee come into contact with metal mask during printing.|
Compared with parameters such as squeegee speed and printing pressure, the amount of solder filling can be easily adjusted.
|Printing pressure||The load applied to the metal mask by squeegee during printing. N or kgf is generally used as the setting units.|
|Agitation (Stirring)||To stabilize printing quality, cream solder shall be mixed to make the distribution of solder powder and flux uniform to keep the viscosity constant. There are cases where a person agitates by a spatula, etc. and a case where agitates by combining rotation and revolution by a machine.|
|Faint||State of insufficient or little solder transfer amount after printing|
|Board clamp||To secure various boards by pinching them horizontally or vertically or both in order to stabilize printing quality and components placement quality.|
Horizontal clamps are often used in printing presses because of close contact with metal masks.
|Carrier transfer||In order to stabilize print and components placement onto boards such as flexible boards that are difficult to maintain their flat shape, they shall be transported in a state of being placed on a jig.|
|Graphic alignment||This function allows easy manual alignment of the board and mask on the monitor screen. Even when the coordinates of the fiducial marks are unknown, alignment can be performed in a short time.|
|Test printing||To optimize the rolling shape and viscosity of solder on the mask by performing printing using a dummy board or a board with film for the first sheet of production or when restart the printing after a certain period of time.|
|Defrost||Cream solder is stored in a refrigerated condition to suppress deterioration over time. The viscosity rises at low temperatures, making it harder and unsuitable for printing. Take the product out of the refrigerator and keep it at room temperature prior.|
|Stringiness||The solder after printing is standing in a square shape. If SMD is mounted as it is, the solder may fall and lead to bridge failure.|
|Lead-free solder||Lead-free solder. It became to be used by the rise of the environmental consciousness.|
|Ooze (Bleed)||The solder transfer amount after printing is too large, and the solder bleeds out of the pattern.|
|Double printing (Overprinting)||The shape and viscosity of the solder on the mask are likely to be inappropriate at first piece of printing or printing after stopping for a certain period of time, and faint of prinitng and the like are likely to occur.|
The transfer amount of solder shall be ensured by performing printing again with the solder shape and viscosity stabilized with respect to the board where faint has occurred.
|Automatic solder transfer||Yamaha SMT printer-YSP10's automation feature. Temporarily hold the solder and maintain the rolling shape when replacing the mask. It can be used effectively not only for automatic mask replacement but also for manual replacement.|
|Mask release||The operation to separate the metal mask from the board after filling the solder by the squeegee. Normally, the board side moves down to perform the plate release operation. Mask releasing speed and distance are commonly programable.|
|Automatic push-up pin replacement||Yamaha SMT Printer-YSP10's automation feature. Automatically replace push-up pins following production program to prevent misplacement of pins due to human error. Two pins can be picked up and placed in one cycle, thus shortening the time required for changing the set-up.|
|Mask vacuum system||To reduce the effect of distortion of the mask frame and elongation of the mesh part by adsorbing and fixing the mask metal part. The board and the mask are forcibly brought into close contact, and stabilization of the printing shape is realized.|
|Automatic mask replacement||Yamaha SMT printer-YSP10 automation feature. By setting a mask to be used for the next production program on the back side of the printing area, the metal mask can be automatically replaced after the production of the current program is finished, and production can be started swiftly.|
|Automatic mask cleaning||Clean the solder and flux adhering to the bottom surface of the metal mask during automatic operation using a cleaning unit equipped with a cleaning paper and a suction mechanism. There are two methods: dry type and wet type using solvents, etc.|
|Backup-up of receiving surface||Supporting the backside of the board rather than a point. Instead of being supported by pins, the board back side can be supported by a block shaped jig, and the board can be firmly supported by a wider area.|