Discontinued models Hybrid Placer & Flip Chip Bonder
Introducing our discontinued model lineup
- Surface Mounter
- Solder-Paste Printer
- Dispenser
- Inspection System
- Hybrid Placer & Flip Chip Bonder
- SMD Storage System
- Management Software
- YSB55w
- Mounting capability : 13,000UPH
- Mounting accuracy (3σ) : ±5μm
- Wafer supply : 12 inch or smaller
* YSB55w is a product of SHINKAWA LTD..
- YSH20
- Mounting capability : 4500UPH
- Mounting accuracy (3σ) : ±10μm
- Wafer supply : 8 inch or smaller
