【Discontinued Product】3D-Xray Hybrid Inspection System YSi-X Specifications, External dimension
Complete renewal and updating of both hardware and image processing software has vastly improved x-ray 3D imaging and led to the advanced TypeHD/TypeHB.
Specifications
| YSi-X | ||
|---|---|---|
| Applicable PCB | ||
| Size | L100 × W50 to L560 × W460mm | |
| Mounted components | Upper limit 40mm, lower limit 80mm (40mm during inline) | |
| Warpage | 2.0mm or less | |
| Weight | 2.0kg or less | |
| X-ray inspection | TypeHD | TypeHB |
| X-ray detector | FOS flat panel system High speed type | Direct conversion panel method Long service life type |
| Resolution | 7 to 54μm | 18 to 54μm |
| Maximum field of view | 62 × 78mm | 52 × 45mm |
| Inspection speed 2D-X | 93.7 ㎠ / sec | 24.0 ㎠ / sec |
| Inspection speed 3D-X | 15.5 ㎠ / sec | 4.0 ㎠ / sec |
| Method | Three-dimensional fault layer inspection by X-ray CT | |
| X-ray source | Microfocus closed tube | |
| Tube voltage | Max. 130KV | |
| Inspection region (PCB center section) | 3D : L510 × W460 mm, 2D : L560 × W460 mm | |
| Visible inspection | ||
| Inspection speed | 0.4 sec. / field of view | |
| Resolution | 10μm / 19μm | |
| Lighting | 3-layer dome lighting, upper White(R/G/B) & infrared, mid-White(R/G/B), lower White(R/G/B) | |
| Image capture system | 5 megapixels digital color camera, telecentric lens | |
| Inspection region | L560 × W460 mm | |
| Laser inspection | ||
| Resolution / Method | 5µm (height direction) / Triangulation distance measurement by laser spot light | |
| Inspection region (PCB center section) | L510 × W360 mm | |
| X-ray leakage quantity | Less than 0.2µSv/h | |
| Power supply / Air supply source | 3-phase AC 200/208/220/240/380/400/416V ±10% 50/60 Hz / 0.45MPa or more | |
| External dimensions / Weight | L1,710 × D1,883 × H1,705mm (excluding protrusions) / Approx. 2,900kg | |
- Specifications and appearance are subject to change without prior notice.
External dimension
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