3D-Xray Hybrid Inspection System YSi-X Feature
Complete renewal and updating of both hardware and image processing software has vastly improved x-ray 3D imaging and led to the advanced TypeHD/TypeHB.
Inspection with 3D X-rays Slice Section Image
Fault layer inspection by X-ray CT
This inspection checks the BGA soldering and so extracts 3D images of just the solder connection.
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Hybrid inspections for high reliability
Equipped with 3D X-ray, 2D X-ray, Visible, Laser and Infrared
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Three-color of the 3 layers → Optical inspection
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Floating leads and component bodies → Laser inspection
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Solder joint → 3D X-ray Inspection
Void inspection performance boosted by 3D X-Ray CT image processing Enhanced void inspections mitigate effects from multilayer/back-side component, component build-in board, etc.
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PCB warping is corrected with XYZ fiducial function
High accuracy information is essential for extracting image of joint surface.
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Data Link with Mounter
Easily load YAMAHA mounter data and import it to inspection data
Mounter data
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- Mounting data
- BGA pin information
- Fiducial data
- Component lead shape
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Makes inspection data
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- Assigns inspection field of view
- Auto collating of inspection library data
ECO
ECO operation capable of 3D imaging by pulse emission with minimal X-ray irradiation
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X-ray source & X-ray detector material renewal fee service contracts are also available.
(Contact us for inquiries regarding conditions and price, etc.)
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Related contents
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- Product
- Introduce our product lineup, including surface mounters, solder printers, and visual inspection machines.
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- Showroom
- Find and explore SMT Smart Showroom or Virtual Showroom
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- Intelligent Factory
- IoT/M2M Integration system - System allows linking our SMT machines to equipment made by other companies and give all-around high productivity in the mounting process.