48th INTERNEPCON JAPAN Past Exhibitions Japanese Chinese Exhibition Outline 48th INTERNEPCON JAPAN Dates 16 [Wed.] - 18 [Fri.] January, 2019 Venue Tokyo Big Sight, Japan Booth No. East 2 Hall, E13-48 The exhibit products YST15 Intelligent SMD Storage System Z:LEX YSM20R High-end High-efficiency Modular Σ-G5SⅡ Premium Modular YSi-SP 3D Solder Paste Inspection Machine Auto Loading Feeder Auto Loading Feeder Z:TA-R Ultra-High-Speed Modular S20 3D Hybrid Modular YSi-V High-end Hybrid optical inspection system (AOI)