34th INTERNEPCON JAPAN
Past Exhibitions
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Exhibition Outline
Dates | Jan. 15 [Wed] - 17 [Fri], 2020 |
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Venue | Tokyo Big Sight, Japan |
Booth No. | South 1 Hall, S3-34 |
The exhibit products
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- YRM20
- Premium High-efficiency Modular
- NEW
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- Z:LEX YSM20R
- High-efficiency Modular
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- Z:LEX YSM20WR
- High-efficiency Modular
- NEW
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- Σ-G5SⅡ
- Premium Modular
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- S20
- 3D Hybrid Modular
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- YSP10
- Premium printer
- NEW
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- YSi-SP
- 3D Solder Paste Inspection Machine
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- YSi-V
- High-end Hybrid optical inspection system (AOI)
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- YST15
- Intelligent SMD Storage System
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- Auto Loading Feeder
- Auto Loading Feeder