34th INTERNEPCON JAPAN
Past Exhibitions
Exhibition Outline
Dates | Jan. 15 [Wed] - 17 [Fri], 2020 |
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Venue | Tokyo Big Sight, Japan |
Booth No. | South 1 Hall, S3-34 |
The exhibit products
- YRM20
- Premium High-efficiency Modular
- NEW
- Z:LEX YSM20R
- High-efficiency Modular
- Z:LEX YSM20WR
- High-efficiency Modular
- NEW
- Σ-G5SⅡ
- Premium Modular
- S20
- 3D Hybrid Modular
- YSP10
- Premium printer
- NEW
- YSi-SP
- 3D Solder Paste Inspection Machine
- YSi-V
- High-end Hybrid optical inspection system (AOI)
- YST15
- Intelligent SMD Storage System
- Auto Loading Feeder
- Auto Loading Feeder