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Yamaha Motor Revs Your Heart

SMT ASSEMBLY SYSTEM

High-Speed & High-Accuracy Flip Chip Bonder YSB55w Overview

High bonding accuracy and x3 productivity of conventional machines! This brings a New Era in Semiconductor packaging for the expanding flip chip market.

High-Speed & High-Accuracy Flip Chip Bonder YSB55w
  • High bonding accuracy and x3 productivity of conventional machines!
    This brings a New Era in Semiconductor packaging for the expanding flip chip market.
  • High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
  • High-Accuracy ±5μm (3σ)
  • High-Quality & Flexibility

Function and Feature

High-Speed. 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH

Multi-die supply

Wafer feed unit

High rigidity frame & beam

Recommend for Such Production Site

For customers who have a vital share in the all-around semiconductor mass-production market

Combining high speed, high accuracy and high versatility to a whole new dimension.

High speed bonding: UPH13,000+

  • 8 heads per stage x 2 stages =16 head configuration.
  • Realizes high speed by inline multi-head technology inherited from Yamaha.
  • Parallel processing in 2 stages by 8-die simultaneous pickup/mounting and simultaneous transfer process.

High-accuracy bonding: 5um

  • High rigidity machine frame created by meticulous structural analysis and verification via extensive testing
  • Compensation algorithm absorbs changes in machine status over the passage of time
  • High-speed and high-accuracy mounting position offset by high-resolution bump recognition camera

High versatility ensures stress-free production changeovers.

  • Equipped with auto tool changer.
  • Quick release function for flux plate ensures safe and secure thickness settings.

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