High-Speed & High-Accuracy Flip Chip Bonder YSB55w Overview
High bonding accuracy and x3 productivity of conventional machines! This brings a New Era in Semiconductor packaging for the expanding flip chip market.
- High bonding accuracy and x3 productivity of conventional machines!
This brings a New Era in Semiconductor packaging for the expanding flip chip market. - High-Speed 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
- High-Accuracy ±5μm (3σ)
- High-Quality & Flexibility
Function and Feature
High-Speed. 8-die simultaneous pickup & simultaneous transfer achieve 13,000 UPH
Multi-die supply
Wafer feed unit
High rigidity frame & beam
Recommend for Such Production Site
For customers who have a vital share in the all-around semiconductor mass-production market
Combining high speed, high accuracy and high versatility to a whole new dimension.
High speed bonding: UPH13,000+
- 8 heads per stage x 2 stages =16 head configuration.
- Realizes high speed by inline multi-head technology inherited from Yamaha.
- Parallel processing in 2 stages by 8-die simultaneous pickup/mounting and simultaneous transfer process.
High-accuracy bonding: 5um
- High rigidity machine frame created by meticulous structural analysis and verification via extensive testing
- Compensation algorithm absorbs changes in machine status over the passage of time
- High-speed and high-accuracy mounting position offset by high-resolution bump recognition camera
High versatility ensures stress-free production changeovers.
- Equipped with auto tool changer.
- Quick release function for flux plate ensures safe and secure thickness settings.
