3D High-speed Solder Paste Inspection Machine YSi-SP Specifications, External dimension
Eagerly awaited SPI from Yamaha Gives your one stop solution from printing machine to AOI
Specifications
| YSi-SP | ||
|---|---|---|
| Applicable PCB | L510×W460mm～L50×W50mm (single lane spec) *No dual lane specification available. |
|
| Horizontal resolution (FOV size) |
1) 25μm / 12.5μm / 8.5μm (approx. 50 x 50mm) 2) 20μm / 10μm / 7μm (approx. 40 x 50mm) 3) 15μm / 7.5μm / 5μm (approx. 30 x 30mm) Note : All are standard selection type. |
|
| Height resolution | 1µm | |
| Inspection items | Solder paste printing quality (volume, height, area and misalignment) | |
| Power supply | Single-phase AC 200V–230V ±10% | |
| Air supply source | Airless specification | |
| External dimension | L904×W1,080×H1,478 mm | |
| Weight | Approx. 550 kg | |
- Specifications and appearance are subject to change without prior notice.
External dimension
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