37th INTERNEPCON JAPAN
SMT related Exhibition and more
Exhibition Outline
| Dates | Jan. 25 [Wed] - 27 [Fri], 2023 |
|---|---|
| Venue | Tokyo Big Sight, Japan |
| Booth No. | East 2 Hall, No.12-1 |
The exhibit products
- YRM20
- Premium High-efficiency Modular
- Z:LEX YSM20R
- High-efficiency Modular
- Σ-G5SⅡ
- Premium Modular
Although this product will not be on display, our staff will explain it in detail.
- YSP10
- Premium printer
- YSD
- High-speed Dispenser
- YRi-V
- 3D Hybrid Optical Inspection System
- YSi-SP
- 3D High-speed Solder Paste Inspection Machine
- YRH10(i-Cube10)
- Hybrid Placer
- YST15
- Intelligent SMD Storage System
Although this product will not be on display, our staff will explain it in detail.
- YSUP
- IoT/M2M Integration system
- SEMI SMT-ELS
- M2M communication standard for smart factories
Although this product will not be on display, our staff will explain it in detail.
