36th INTERNEPCON JAPAN
SMT related Exhibition and more
Exhibition Outline
| Dates | Jan. 19 [Wed] - 21 [Fri], 2022 |
|---|---|
| Venue | Tokyo Big Sight, Japan |
| Booth No. | East 2 Hall, No.13-2 |
The exhibit products
- YRM20
- Premium High-efficiency Modular
- NEW
- YRi-V
- 3D Hybrid Optical Inspection System
- NEW
- YRH10(i-Cube10)
- Hybrid Placer
- NEW
- Z:LEX YSM20R
- High-efficiency Modular
- Σ-G5SⅡ
- Premium Modular
- YSP10
- Premium printer
- YSD
- High-speed Dispenser
- YSi-SP
- 3D High-speed Solder Paste Inspection Machine
- YSi-V
- 3D Hybrid optical inspection system (AOI)
- YST15
- Intelligent SMD Storage System
YST15 will not be on display, but our staff will explain it in detail.
- YSUP
- IoT/M2M Integration system
- NEW
