3D High-speed Solder Paste Inspection Machine YSi-SP Feature

“1-head solution” to perform various inspections with a single head

One head type supports all types of inspections. Eliminate all types of losses such as time and cost to increase your actual productivity.

Achieves high-accuracy high-speed inspections using 3D+2D inspection, image resolution switch-over and more

Highly accurate 3D inspections by applying unique 3-step algorithm

01Focus adjustment

The camera height corrects by automatic focus adjustment to follow up on any PCB warpage down to ± 5 mm.

02Surface area measurement

Measure the surface area by accurately extracting the contour of the solder paste by 2D ring lighting.

03Height measurement

Measure height of solder paste by phase shift method and extract volume value.

High precision 2D contour extraction

Reproduces accurate shapes by combining with phase shift method.

Accurately reproducing shapes is difficult due to noise.

Gives high reproducibility for extracting contours by 2D inspection.

Select from a maximum 3 types of resolution

Super high-resolution technology makes automated inspections on the same type PCB while switching between a maximum of 3 resolution levels Unit flexibly handles components from super-tiny components to large-size components.

Extensive machine-to-machine (M2M)solution

The Yamaha brand can provide all main equipment needed for component mounting in one package and by linking SPI with each piece of equipment creates a production line having boosted quality and productivity.

Automatic setup changes

Settings such as production line PCB data and conveyor width are sequentially sent from upstream units by scanning ID such as for barcodes listed on PCB and instruction sheets to automatically to shorten the time needed to switch setups and make changeovers.

Feedback print offset

Feedback print offset and initiate cleaning cycle acquired by SPI to the downstream printer to give high print quality.

Remote pass-fail judgment

One PC handles second pass-fail judgment of both AOI and SPI. This makes better job efficiency of second pass-fail judgment.

Automatically converts coating inspection data

Create coating data from the dispenser and send to SPI in just one click!

Simultaneous image display in each process (Process Correlation)

Swiftly pinpoints the process where a failure occurred by displaying images from and the production status of each process simultaneously to support production process quality improvement.

Solder paste printing analysis

Displays link between fluctuations in solder size and solder paste printing status and allows checking the solder paste printer status when defects or problems occur. Streamline quality improvements and line operating rate.