Hybrid Placer YRH10 / YRH10W Specifications

A hybrid placer enabling mixed semiconductor and SMD mounting, ideal for module production

Specifications

			YRH10	YRH10W
Applicable components	Die	Die size	L0.2 x W0.2mm to L16 x W16mm	L0.35 x W0.35mm to L16 x W16mm
		Die thickness	0.1 to 0.5mm
		Wafer size	6/8inch	6/8/12inch
	SMD	Component size	0201 to L16 x W16mm, Height 15mm or less^{Note 1}
	SMD	Tape size	8 to 104mm
Wafer mounting capacity			14,000UPH^{Note 2}
Chip mounting capacity			29,000CPH^{Note 2}
Mounting accuracy			±15㎛ Cpk≧1.0
Number of component types			Reel : Max. 48 types, Wafer : Max. 10 types	Reel : Max. 64 types, Wafer : Max. 10 types
Applicable PCB			L50 x W30mm to L330 x W250mm	L50 x W60mm to L510 x W460mm
PCB thickness / Max. carrying weight			0.1 to 4.0mm / 1kg	0.8 to 20mm / 10kg
Power supply			3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz
Air supply source			Over 0.45 MPa, clean and dry state
External dimension			L1,252 x W1,962 x H1,853mm	L1,374 x W2,602 x H1,849mm
Weight			Approx. 1,560kg	Approx. 2,635kg

Note: Specifications and appearance are subject to change without prior notice.