Hybrid Placer YRH10 / YRH10W Feature
A hybrid placer enabling mixed semiconductor and SMD mounting, ideal for module production
Hybrid mounting
This system enables both semiconductor and surface-mount device (SMD) mounting in a single machine, supporting diverse supply formats and flexible mounting processes that can be customized to meet a wide range of production needs.
Supply patterns
Pin transfer of adhesives (option)
Example of module component packaging process
Pallet types
Wafer pallets (standard)
Waffle tray pallets (custom order)
High-speed and high-accuracy mounting
Regardless of PCB conditions, the system achieves high-accuracy mounting of ±15 µm (Cpk ≥ 1.0), ensuring the accuracy requirements for semiconductor mounting. The 10-nozzle mounting head significantly reduces cycle time while maintaining high-accuracy mounting, delivering exceptional productivity.
| YRH10 / YRH10W | 14,000 UPH |
|---|---|
| ±15㎛(Cpk≧1.0) |
Optimized mounting operation
Equipped with a scan camera on the mounting head, the system completes component recognition during travel after wafer pickup. This enables it to move to the mounting position along the shortest path, resulting in an efficient operating cycle that improves productivity.
Reduced risk of component damage and scattering
Load cell-based measurement and calibration enable optimal control of the pressure applied to components. This prevents damage and deformation of tiny chip components and thin components, while ensuring reliable pressing for components that require applied pressure.
The PCB surface is measured by a laser and the nozzle height by a touch sensor, with the results applied to the mounting height setting. This prevents component indentation and scattering.
Maintains high accuracy regardless of PCB conditions or operating time
Z-axis control of the fiducial camera tracks PCB height, enabling accurate mark recognition even on complex or multilayer PCBs. This ensures consistently high-accuracy component mounting, unaffected by PCB variations.
Markers installed in the machine are regularly recognized and corrected to minimize degradation in mounting accuracy caused by thermal changes. This maintains high-accuracy mounting regardless of operating time or conditions.
Prevents mounting failure in advance
The side-view camera checks the posture of the component before mounting to reject any factors that may cause defects, delivering defect-free production.
Side lighting meticulously detects missing BGA balls that cannot be detected with lighting from underneath.
High versatility with reduced labor requirements
Simplified changeover work reduces workload
The system is equipped with two wafer ejector units, allowing for the handling of different die sizes without requiring a changeover. When combined with an auto nozzle changer, overall versatility is further enhanced.
Wafer angle and pitch are automatically corrected during production to reduce teaching workload and errors during changeover.
Promotes rapid and reliable improvements
All component recognition images and mark recognition images are saved, facilitating root cause analysis and improvement activities when errors or defects occur.
"Any time" "Skill-less" components supply
Efficient component replenishment can be performed at any time, reducing the risk of machine downtime and ensuring stable production.
Production support functions that reduce processing time
Wafer maps are read from a barcode on the wafer ring, with automatic conversion from various formats supported.
Automatically optimizes head selection and mounting order, improving tact time and reducing data creation time.
Automatically determines the optimal component placement and pickup sequence, enabling cycle time estimation.
YRH10W dedicated features
Compatible with 12-inch wafers
Supports mounting of 6, 8, and 12-inch wafers.
Enhanced productivity with large and heavy PCB conveyance
Jig PCBs equivalent to L-size PCBs can be conveyed, increasing the number of PCBs processed per reflow process, which is often a production bottleneck, and improving overall production volume.
Model layout (YRH10)
Layout customization to suit the products being manufactured.
A balance of versatility and productivity that supports efficient production processes.
