Glossary
Terms | Explanations |
---|---|
Printed circuit board(PCB) | In the SMT industry, an electronic circuit is formed by plating and printing process on to a plate-shaped "object" in order to connect each of electronic component. Generally this "object" is made of solidifying glass fiber fabrics with glass epoxy resin are commonly called "Gara Epoxy Substrates (or board)", and there are several types such as "Aluminum Substrates (or board)" in which heat dissipation is enhanced using aluminum as a main material, and "Flexible Substrates (or board) (FPCB)" in which bending resistance of moving parts is provided. Prior to the advent of these substrates, paper phenol substrates, which were prepared by consolidation of papermaking equipment with phenolic resins, were the main substrates. |
Board finish | In order to facilitate soldering, solder leveler, electrolytic gold plating, electroless gold flush, heat resistant preflux, etc. shall be processed on the land in the condition of the raw board in advance. |
Block (Panel) | Each board that constitutes a collective board (e.g., four collective boards per sheet). |
Jumper | A part that connects conductor patterns to achieve three-dimensional wiring on a single-sided board, etc. Sometimes referred to as zero ohmic resistance. |
Collective board | A board (sheet) consisting of a single block (panel) of multiple products, with the purpose of lowering the production unit price of raw boards and making the SMT process more efficient. |
Copper foil | Thin copper used as a material for the conductive pattern of the board. There are two types, electrolytic copper foil and rolled copper foil, and the electrolytic copper foil is used except for the flexible board (FPCB). |
Bad mark | A mark to be attached to a block (panel) of a board with multiple block that is defective and is not subject to production. |
Build-up boards and multilayer boards | A board in which a plurality of layers of electronic circuits are formed to form complex electronic circuits. |
V-cut | A ditch attached for the purpose of easily dividing block and unnecessary parts after the SMT process. |
Fiducial mark | A reference point provided on a board to perform high-precision alignment with a P&P, printing press, or the like. Normally, two-point marks are provided on the diagonal of the board to correct the deviation of the XYR and the expansion and contraction of the board. Copper patterns (lands) are usually used as marks to ensure relative accuracy with the lands on which components are mounted. |
Flexible print circuit board (FPCB) | A board with a thin sheet shape and flexibility. It is often used for moving parts of products. |
Plotter diagram | A device which outputs figure data on paper by moving a writing instrument such as a pen by computer control is called a plotter, and in SMT industry, a device which outputs wiring information of a printed circuit board is often called a plotter diagram. Used for checking power lines and routing of important patterns, etc. |
Rigid board | A generic term for a hard board among Printed circuit boards(PCB). |
Resist | An insulator coating material covering the surface to avoid exposing the electronic circuit in the mounting board, which is generally green. Prevent short-circuit-circuiting caused by conductive materials such as solder that have been unintentionally placed on the board. |