Super High Efficiency Dual Lane Modular YRM20DL Specifications, External dimension
The 1 head solution has reached an ultimate stage. A dual-lane surface mounter delivering great productivity, flexibility and ability to take on PCB.
Specifications
| Model | YRM20 | ||
|---|---|---|---|
| Super high-speed rotary RM head | High-speed general-purpose in-line HM head | Odd-shaped components in-line FM (flexible-multi) head | |
| Nozzles (per 1 head unit) | 18 | 10 | 5 |
| Applicable components | 0201mm to W12 x L12mm, Height 6.5mm or less |
0201mm to W55 x L100mm, Height 15mm or less |
03015mm to W55 x L100mm, Height 30mm or less |
| Mounting capability (under optimum conditions) |
120,000CPH Note 1 | 100,000CPH Note 1 | 35,000CPH |
| Mounting accuracy (under optimum conditions) |
±0.015mm Cpk≧1.0 Note 2 | ±0.035mm Cpk≧1.0 | |
| Number of component types | Feeder carriage exchange : Max. 128 types = 32 feeders x 4 (conversion for 8mm tape feeder) Fixed plate : Max. 128 types (conversion for 8mm tape feeder), Trays : 60 types (maximum when equipped with eATS30 x 2) |
||
| PCB dimensions | Single use : L50 x W50mm to L810 x W610mm Dual use : L50 x W50mm to L810 x W330mm |
||
| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz | ||
| Air supply source | 0.45MPa or more, in clean, dry state | ||
| External dimension (excluding projections) |
L1,374 x W2,102 x H1,445mm | ||
| Weight | Approx. 2,550kg (Main unit only) | ||
- Note 1 :
- High-production mode
- Note 2 :
- High-accuracy mode
- Specifications and appearance are subject to change without prior notice.
Automotive packaging specifications
- Independently controlled front-and-rear signal tower
- Automatic Push-up Pin Exchange System
- Auto nozzle station
- Overflow prevention sensor for chip dump box
- Supports safety category 3 and other safety items
External dimension(with eATS30)
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