Discontinued models Hybrid Placer & Flip Chip Bonder
Introducing our discontinued model lineup
- Mounters（Pick and place machines）
- Solder-Paste Printers
- Dispensers
- Inspections
- Hybrid Placers ＆ Flip Chip Bonders
- SMD Storage Systems
- Software Solutions
- YSB55w
- Mounting capability : 13,000UPH
- Mounting accuracy (3σ) : ±5μm
- Wafer supply : 12 inch or smaller
* YSB55w is a product of SHINKAWA LTD..
- YSH20
- Mounting capability : 4500UPH
- Mounting accuracy (3σ) : ±10μm
- Wafer supply : 8 inch or smaller
