Yamaha Motor Co., Ltd. has developed
the new "YS24X" surface mounter with a compact platform and
two mounting heads capable of handling large and irregularly
shaped components plus the various optical recognition systems
and lighting fixtures to enable outstanding component handling.
This new model will be released in March 2010.
The new YS24X achieves excellent productivity in relation
to surface area and great versatility with its capability
to accommodate a wide variety of electronic components, including
irregularly shaped components up to 45mm × 45mm and 15mm
in height.
Despite its compact platform with a width of just 1.25 m,
this model has two multi-heads on independent beams with
each head having 10 nozzles in an in-line configuration to
achieve a superior mounting capability of 54,000 CPH*1 (0.067
sec./chip: Under optimum conditions as defined by Yamaha
Motor) and also has the capability to accommodate extra large
PCB (printed circuit boards), up to L700 × W460mm. What's
more, this model is complete with the optical verification
functions and lighting to enable detection of defects and
flaws of all ball electrodes and a coplanarity check*2 function,
a large-sized nozzle station designed to hold a large number
of nozzles to accommodate a wide range of electronic components
and compatibility with the sATS 15-tray × 2 magazine automatic-replacement
tray supply unit (option) to enable great flexibility in
application.
Plans call for the new YS24X "39th Internepcon
Japan" show featuring electronics mounting technology that
will be held from January 20 to 22 at Tokyo Big Sight, Japan
(Ariake Koto-ku, Tokyo).
|
| *1 |
CPH (Chips Per Hour): Total number of
chips that can be mounted per hour (unit time). Indicates
processing capability under various conditions. |
| *2 |
Coplanarity check: An inspection system
that detects the positions of the electrode leads of
the many electronic components mounted and the uniformity
in height and direction of the ball electrodes on the
bottoms of components and compares them with PCB (printed
circuit board) pattern to ensure the reliability of electrode
connections. |
|
 |
"YS24X" Compact
High-speed Flexible Modular Mounter
|
Name:
|
"YS24X" Compact High-speed Flexible Modular
Mounter
|
Release Date:
|
March 2010
|
Sales Forecast First
Fiscal Year:
|
100 units (domestic and overseas)
|
In recent years, chip (electronic
component) mounting facilities are confronted with a diverse
range of demands, including adapting to new LED products,
large flat-screen televisions and mobile devices and the
new components they utilize. At the same time, they must
also be able to make the efficient use of plant space, have
flexible line configurations, while reducing energy consumption
and environmental impact.
The "YS24X" is a model that has been developed to respond
to these market needs while also achieving great versatility
with the capability to handle large and irregularly shaped
components and accommodate two or more kinds of tray component
supply. When used inline with Yamaha Motor's YS24 model,
with its highest level of area productivity, this new model
makes it possible to create production lines that can accommodate
a wider range of product genres while further boosting productivity.
|
| (1) |
| Versatility to handle components ranging
in size from 0402*3 to 45mm × 45mm and a maximum
height of 15mm, while also achieving an outstanding mounting
capability of 54,000 CPH (0.067 sec./chip: Under optimum
conditions as defined by Yamaha Motor) |
| • |
 |
Two multi-heads, each having 10 nozzles in an in-line
configuration for the capability to handle large components
and irregularly shaped components |
| • |
Fully rigid dual drive two-beam configuration |
| • |
Large nozzle station designed to hold a large number
of nozzles to accommodate a wide range of electronic
components |
| *3 |
0402: Super-small electronic components of 0.4mm × 0.2mm |
|
|
| (2) |
Compatibility with the sATS 15-tray × 2 magazine automatic-replacement
tray supply unit (option) to enable supply of a larger variety
of component types |
| (3) |
| Multi cameras fitted with vertically adjustable side
lights. This enables accurate verification and mounting
of ball-electrode type components BGA/CSP*4. |
| *4 |
BGA/CSP: Ball Grid Array & Chip Size Package |
|
|
| (4) |
Coplanarity checker to detect irregularities in electrode
height and direction to ensure reliability of connections for
a large number of component electrodes, including QFP/large
SOP and BGA/CSP |
| (5) |
Compact external dimensions of 1,254 mm in width and 1,687
mm in depth. Depth of 2,020mm when coupled with the sATS tray
component supply unit |
| (6) |
Capability to handle super-large PCBs (printed circuit boards)
(L700 × W460mm) to answer market needs for large flat panel
TVs and LED light fixture PCB and large industrial-use PCB
mounting |
| (7) |
Compatibility with the electric-drive intelligent tape feeder "SS
Feeder" that employs microcomputer control to provide high-speed
components supply and high-accuracy components positioning,
thus ensuring excellent job setup efficiency and enabling job
failure prevention functions |
| (8) |
| High Mounting Quality Guaranteed |
| • |
|
The "MACS (Multiple Accuracy Compensation System)" has
been adopted. It compensates for various factors that
change accuracy in a complex and multi-faceted manner,
guaranteeing a constant mounting accuracy of ?0.05mm. |
|
| (9) |
| Actual Operating Ratio increased by Ease
of Maintenance |
| • |
|
Nozzles common with the "YS12," "YS100" and "YS24" have
been adopted to ensure superior ease of maintenance. |
| • |
Standard provision of a "Blow Station" enables self-cleaning
of the nozzle shaft, reducing the amount of maintenance
work. |
|
| (10) |
| Achieves Superior Ease of Operation |
| • |
|
Graphic display design with superior ease of operation
has been adopted. An easy to view and easy to understand
man-machine interface achieves very easy operation. |
| • |
Higher operating ratio and superior quality control
are supported by the below software "Y.FacT" and "IT
Option". |
| • |
One of four display languages (Japanese, English, Chinese
or Korean) can be selected according to the location
where the unit is installed. |
|
| (11) |
| Safety and Environmental Considerations |
| • |
|
Device is compatible with CE marking *5 to
ensure safe device design, enabling it to be marked around
the world. |
| • |
Compatible with air supply source of 0.45MPa. |
| *5 |
CE Marking: Name of mark indicating device conforms
with safety requirements for devices installed
and used in European region. |
|
|
| Model Name |
YS24X |
| Applicable PCB |
L50 × W50mm - L700 × W460mm |
| Mounting Capability |
54,000CPH (0.067 sec./CHIP conversion: Optimum conditions
established by Yamaha Motor) |
| Mounting Accuracy |
Absolute accuracy (μ + 3σ): ±0.05mm/CHIP, ±0.05mm/QFP
Repeatability (3σ): ±0.03mm/CHIP, ±0.03mm/QFP |
| Applicable Components |
0402 - 45mm × 45mm, Height 15mm or less,
Ball type electrode components applicable
* 32 × 32mm or more needs special nozzle set |
| Component Types |
Tape reel: 96 types (Max.,8mm tape reel conversion)
Tray: 30 types (Max., JEDEC trays conversion) |
| Power Supply |
3-Phase AC 200/208/220/240/380/400/416 V ±10% |
| Air Supply Source |
0.45MPa |
External Dimensions
(not-including the projection) |
L1,254 × W1,687 × H1,445mm (Main unit only)
L1,254 × W2,020 × H1,545mm (When sATS is installed) |
| Weight |
Approx. 1,700kg (Main unit only)
Approx. 1,870kg (When sATS is installed) |
|
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