Release of the new Yamaha 3D X-ray Hybrid Inspection System "YSi-X"

Yamaha Motor Co., Ltd. will release from July 1, 2012 the new automated X-ray and optical inspection system "YSi-X." This is a multi-function 3D X-ray hybrid-type inspection system capable of complete in-line inspection of all facets of printed circuit boards thanks to a 3D X-ray inspection function through newly developed Yamaha-exclusive high-speed X-ray laminography imaging technology and multiple inspection functions utilizing optics and lasers.

The YSi-X features 3D inspection algorithms as standard equipment for identifying defects such as insufficient solder joint, un-melted, openings, bridging, XY shifting, θ rotation, insufficient ball size, missing ball, and voids in ball. It also achieves the highest level of 3D inspection speed in the industry at 3.3 sec./FOV (under optimum conditions defined by Yamaha) due to new Yamaha-exclusive X-ray laminography imaging technology.

This model also boasts a hybrid design that couples 2D and 3D X-ray inspection functions, optical inspection and laser measurement function for height inspection to enable selection of the optimum measurement method for each part to be inspected, thus providing efficient, high-precision inspection. Because this hybrid capability eliminates the need for a separate optical inspection unit necessary in conventional lines, the new YSi-X also reduces overall investment for an SMT production line.

Furthermore, adoption of the latest technologies for the X-ray source and X-ray detector and the use of Yamaha-exclusive control technology has extended the full-operation life of the X ray tubes and the X-ray detector to a long life of four years. This greatly reduces the running cost for the X-ray source and the X-ray detector.

(*1) Based on optimum conditions defined by Yamaha

As many industries answer the need for products that are more compact, have more functions and higher levels of performance, there has been a rapid increase in the use of underside electrode type components in recent years. Because the solder joints for these parts lie under the component, the solder can't be fully inspected by exterior optical or visual inspection. Also, because electrical circuit tests and function tests can't detect the strength of the solder joint, it is necessary to use X-ray inspection to detect solder defects.

Particularly in the case of commercial/industrial-use products such as automotive components or server-use computers that require especially high levels of reliability and guarantee against malfunction, it is not sufficient to simply replace parts after a failure occurs. What's more, these components are produced in large numbers. Therefore, the use of underside electrode type components creates the need to include an X-ray inspection system on the production line to conduct complete inspections of all aspects of printed circuit boards (PCB) in-line to detect possible solder defects.

Furthermore, the need for numerous bypass condensers directly below BGA/CSP components (on the back side of the PCB) to prevent noise causes overlapping of the images of the BGA/CSP components and back-mounted components, thus making 3D X-ray inspection necessary, rather than 2D X-ray. However, putting a 3D X-ray inspection system in the production line can easily create a bottleneck in terms of cycle time, while also increasing running cost considerably. This need for a double investment in an optical inspection system and a 3D X-ray inspection system has proved to be a problem for manufacturers.

The new YSi-X is designed to solve this problem in conventional X-ray inspection by creating one hybrid machine capable of performing 3D X-ray inspection as well as 2D X-ray inspection and optics and infrared functions for optical inspection and laser-enabled distance measurement for height inspection. Development of this machine has been made possible by newly developed Yamaha-exclusive X-ray laminography imaging technology capable of separating and selecting the inspection target cross-sections, while also achieving the highest level of 3D X-ray inspection speed in the industry at 3.3 sec./FOV and lengthening the service life of the X-ray source and X-ray tubes.