- By direct pick-up, excellent wafer-barechip mounting tact 6,000CPH and quality as assured
- Capable of mixed mounting of SMD components and semi-conductor components
- Optimum for the assembly process of MEMS, Power Modules, CCD/CMOS Sensor, LED, components
|PCB dimensions||L300xW150mm(Max) to L30xW30(min)|
When using Yamaha's standard components
|Mounting cycle time
Under optimum conditions
- * About details, please consult us separately.
- Specifications and appearance are subject to change without prior notice.