2012.5.8 3D X-ray Hybrid Inspection System "YSi-X" 2012.3.22 “YC8” wide-range compact modular surface mounter 2012.3.13 High-density Modular Mounter "YSM40", adopting 4-beam, 4-head layout 2012.1.22 D×D Solder-paste Printer "YSP20", adopting dual-stage, dual-stencil 2013.5.8 We will exhibit "15th Jisso Process Technology Exhibition". 2012.12.18 We exhibited "42nd INTERNEPCON JAPAN". 2012.5.8 We exhibited "14th Jisso Process Technology Exhibition". News Release Inquiry Campaign Exhibition Industrial Robots
2012.5.8 3D X-ray Hybrid Inspection System "YSi-X" 2012.3.22 “YC8” wide-range compact modular surface mounter 2012.3.13 High-density Modular Mounter "YSM40", adopting 4-beam, 4-head layout 2012.1.22 D×D Solder-paste Printer "YSP20", adopting dual-stage, dual-stencil
2013.5.8 We will exhibit "15th Jisso Process Technology Exhibition". 2012.12.18 We exhibited "42nd INTERNEPCON JAPAN". 2012.5.8 We exhibited "14th Jisso Process Technology Exhibition".
